Analysts said demand for Taiwan Semiconductor Manufacturing Co's (TSMC) 3-nanometre and 2-nanometre process technologies for AI chips, as well as for its advanced chip packaging technology, CoWoS, remains strong.
Analysts said demand for Taiwan Semiconductor Manufacturing Co's (TSMC) 3-nanometre and 2-nanometre process technologies for AI chips, as well as for its advanced chip packaging technology, CoWoS, remains strong.
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